Application Scenarios

A special ultra-hard grinding wheel is designed for processing the chamfering of semiconductor wafer edges. By performing circular arc and inclined surface contour grinding on the wafer edges, it addresses issues such as edge brittleness and stress concentration, thereby enhancing the mechanical stability and adaptability for subsequent processing of the wafer.

Product Features

High profile accuracy, good wear resistance,High-precision, consistent beveling,Burr- free,chipping-free edges,Supports R-angle and chamfer requirements.

Process Compatibility

Suitable for all wafer sizes. Customizable bond, grit and profile for wafer materials and beveling machines (semi‑automatic / automatic).

Model Specifications