Application Scenarios

With the increasing application of sapphire substrates in advanced packaging, higher demands are placed on substrate surface quality, total thickness variation (TTV), and warp, which in turn drives higher requirements for thinning wheels.

• 1.High sharpness for superior removal efficiency

• 2.Good bond toughness ensures low impact, low stress,and low subsurface damage

• 3.Optimized porosity provides appropriate friction toavoid slipping

• 4.Excellent self-sharpening - no passivation or clog-ging - resulting in a clean, scratch free surface

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Model Specifications