Application Scenarios

Formulated with a specialized resin bond and fine-grit diamond abrasives, this wheel delivers a gentle grinding force that prevents scratching, chip adhesion, and deformation. Achieves surface roughness Ra s 10 nm. Customizable specifications are available, suitable for processing various germanium wafers,widely used in defense, military, aerospace, and aviation industries.

• 1.Excellent self-sharpening and chip evacuation - resists clog-ging

• 2.High sharpness, ensuring low stress and low impact force

• 3.Good heat dissipation, providing low thermal damage

• 4.Uniform abrasive distribution - no surface scratchesa

• 5.High flatness accuracy, ensuring uniform thinning and low TTV

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Model Specifications