Application Scenarios
The properties of different polymorph gallium oxide vary greatly.By adopting ultra-fine diamond abrasives and optimized vitrified bond, rough grinding and finish grinding of various gallium oxide substrates can be realized. It features stable grinding performance and low wear, providing technical support for the production of new wide-bandgap semiconductor devices.
1.High self-sharpening, clogging resistance - ensures stable grinding
2.Excellent sharpness, guaranteeing low-stress, low-damage processing.
3.High heat generation during grinding - superior wheel heat dissipation avoids thermal cracks
4.High end-face accuracy, ensuring uniform thinning and low TTV
Model Specifications

6A2T
Model | D | T | H | X | W | Bond | Grit Size |
6A2T | 209 254 | 30 | 95 155 158 | 5 7 | 2 3 4.5 4 | B V | 2000 8000 |
Workpiece | Ga₂O₃ Wafer |
Workpiece Size | 2-Inch (Bonded on 4-Inch wafer) |
Wheel Specifications | 6A2T D313 (12 In) V 2000 |
G-Ratio(Wheel wear : Workoiece removal) | 1:8 |
TTV | ≤2μm |