Application Scenarios

Resin bond is chosen, with gentle grinding force and a roughness of Ra≤10nm. Customized specifications are avail-able, suitable for small-batch high-precision processing,and compatible with precision thinning equipment. The precision and efficiency reach leading level of the industry.

• 1.Good toughness and excellent surface quality

• 2.High sharpness, low stress, and low subsurface damage

• 3.Excellent self-sharpening, easy chip evacuation - no chip adhesion or wheel clogging

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Model Specifications