Application Scenarios

Vitrified/resin bond utilized, suitable for IC packaging process; surface roughness Ra < 2 nm, TTV s 3 μm. Alumi-num alloy substrate with high thermal conductivity and corrosion resistance.Rotational speed: 1000-3500 r/min, feed rate: 1.0-1.4 μm/s, compatible with mainstream equipment.

• 1.Ultra-high speed, high stock removal

• 2. Extremely low subsurface damage (SSD)

• 3.High flatness, low TTV

• 4.Strong self-sharpening, no passivation

• 5.Ultra-light grinding force, low stress

• 6.Zero metallic contamination

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Model Specifications