Application Scenarios

The double-sided thinning of wheels for semiconductor silicon wafers is specially designed for the precise double-sided grinding of wafers, with high flatness, low damage, low contamination, long service life, and stable grinding performance. It is used to achieve high-precision thickness control, parallelism control, and low-dam-age surface processing of silicon wafers.

• 1. Ultra high thickness uniformity & flatness

• 2. Low subsurface damage

• 3.Zero metallic contamination

• 4.Excellent self sharpening & stable grinding force

• 5.Good cooling & chip evacuation

• 6.Low wear, long service life

• 
  

Model Specifications