Application Scenarios
Special vitrified bond is utilized to remove surface damage layers with excellent heat dissipation, microcracks preventing. Infeed rate: 0.8 μm/s. Efficiency improvement: >30% (compared to other products)
Model Specifications
6A2T
Model | D | T | H | X | W | Bond | Grit Size |
6A2T | 209 254 313 | 30 | 95 155 158 237 | 5 7 | 2 3 4.5 4 | ML V | 2000 8000 30000 |
Workpiece | Wafer Rough Grinding | Wafer Fine Grinding | Wafer Rough Grinding | Wafer Fine Grinding |
Workpiece Size | 6 Inch | 8 Inch | ||
Wheel Specification | 6A2T D209 (8 Inch) V 800 | 6A2T D209 (8 Inch) V 8000 | 6A2T D209 (8 Inch) V 800 | 6A2T D209 (8 Inch) V 8000 |
G-Ratio(Wheel wear: Workpece removal) | 1:7 | 1:2 | 1:5 | 1:1.5 |
Roughness | - | 2nm | - | 2nm |
TTV | - | < 2μm | - | < 3μm |