Application Scenarios
Suitable for full processes including rough and finishgrinding. Grit sizes cover 2000#, 8000#, 30000#
Rough grinding: Ra<15nm
Finish grinding: Ra<2nm (ready for final polishing directly)
Cost reduction: 40%
Compatible with mainstream thinning machinesModel Specifications
6A2T
Model | D | T | H | X | W | Bond | Grain Size |
6A2T | 209 254 313 | 30 | 95 155 158 237 | 57 | 2 3 4.5 4 | ML V | 2000 8000 30000 |
Workpiece | Wafer Rough Grinding | Wafer Fine Grinding | Wafer Rough Grinding | Wafer Fine Grinding |
Workpiece Size | 6-Inch | 8-Inch | ||
Wheel Specification | D313 (12 Inch) V 2000 | D313 (12 Inch) V 30000 | D313 (12 Inch) V 2000 | D313 (12 Inch) V 30000 |
G-Ratio(Wheel wear : Workoiece removal) | 1:6 | 1:1.8 | 1:4 | 1:1.4 |
Roughness | - | center 1nm edge 2nm | center 1nm edge 2nm | |
TTV | - | < 3μm | - | < 4μm |