Application Scenarios

Special superhard grinding wheels for semiconductor wafer edge chamfering. They grind arc, bevel and other contours on wafer edges to solve problems including edge chipping and stress concentration, improving wafers’ mechanical stability and compatibility with subsequent processes.

Product Features

The grinding wheel features high contour precision and excellent wear resistance. It enables high-precision and consistent chamfering on wafer edges, meeting process requirements for various chamfer specifications (radiused corners, bevel angles). No burrs or edge chipping occur on wafer edges after processing.

Process Compatibility

Supports chamfering of wafers in various sizes. The wheel’s bond type, abrasive grain size and contour dimension can be customized according to wafer materials and chamfering equipment, compatible with both semi-automatic and fully automatic chamfering machines.

Model Specifications