Application Scenarios

Developed for precision ID grinding of ceramics. For high performance ceramic components (alumina, SiC.AIN, AISi) in semiconductor / pan-semiconductor fields. Solves the industry pain point of brittleness, chipping and microcracking.

Product Features

High-quality diamond with self-developed proprietarybond

Uniform abrasives, excellent wear-resisitance and self-sharpening

No loading

High dynamic balance and profile truing

Tight tolerances, smooth walls

Meets coaxiality and perpendicularity standards

Full customization of grit, bond, dimensions based on parameters of inner hole, devices and process.Suitable for small-bore, deep-hole, thin-wall parts. Grind-ing wheel product covers rough, semi-finish, finish grind-ing and provides process guidance to improve efficiency and yield.

Model Specifications