研发团队核心成员均拥有世界500强及国内行业龙头企业从业经验,研发人员(含博士、硕士)占比达15%,在半导体精密磨削技术研发上具备深厚技术积淀。
研发团队核心成员均拥有世界500强及国内行业龙头企业从业经验,研发人员(含博士、硕士)占比达15%,在半导体精密磨削技术研发上具备深厚技术积淀。
Automates key processes such as solder paste management, labeling, and coding, increasing production efficiency by 30%~50%
Ensures precise control of temperature, humidity, and labeling/coding accuracy, reducing product defect rates by 20%~40%;
Integrates all equipment with MES systems, enabling data-driven production management and facilitating smart factory upgrades.