与国内顶级高校、院所建立长期深度合作,聚焦半导体行业尖端磨削课题开展关键技术联合攻关，精准突破行业核心技术难点。
与国内顶级高校、院所建立长期深度合作,聚焦半导体行业尖端磨削课题开展关键技术联合攻关，精准突破行业核心技术难点。
Automates key processes such as solder paste management, labeling, and coding, increasing production efficiency by 30%~50%
Ensures precise control of temperature, humidity, and labeling/coding accuracy, reducing product defect rates by 20%~40%;
Integrates all equipment with MES systems, enabling data-driven production management and facilitating smart factory upgrades.