Download, fill in and send to the email：sales@h-grinding.com
Wafer Thinning Grinding Wheel Test Information Collection Form – iangsu Horn Precision Technology Co., Ltd. 1. Customers must confirm the grinding wheel drawing before testing！ 【Grinding Wheel Size (Required): inch】 | ||||||||||||||||||||||||||
Customer Name | Contact Information | |||||||||||||||||||||||||
Filling Date | ||||||||||||||||||||||||||
Wafer Information (Partially Required) | ||||||||||||||||||||||||||
Wafer | Wafer | Manufacturer / | (Optional） | Target Thickness | ||||||||||||||||||||||
Wafer | (Optional) | Lamination | FilmThickness/μm | Initial Thickness | ||||||||||||||||||||||
Machine Info（All Required） | ||||||||||||||||||||||||||
Brand | Spindle | Air/Mechanical Bearing | Spindle Power/kw | No-load | ||||||||||||||||||||||
Customer Requirements / Expected Specifications | ||||||||||||||||||||||||||
Wear Ratio | Current/A | Max： | Other | |||||||||||||||||||||||
Ra/nm | TTV | Bow | Warp | |||||||||||||||||||||||
Other Special Requirements（Including special clamping methods, particle, scratch and other special requirements） | Current / Tested Wheel Conditions（Grinding wheel brand, mesh size, processing parameters, existing problems and other information） | |||||||||||||||||||||||||